Pan Pacific Symposium Conference Proceedings


2Advanced Semiconductor Engineering Test RD

Authors: Martin Anselm, Ph.D., and Wayne Jones
Company: Universal Instruments Corporation, Advanced Process Laboratory
Date Published: 1/22/2013   Conference: Pan Pacific Symposium


Abstract: As complexity in advanced manufacturing increases, especially for consumer electronics, the need to characterize the materials and processes used in electronic assembly also increases. OEM and EMS companies look to perform characterizations as early as possible in the process to be able to limit quality related issues and improve both assembly yields and ultimate device reliability. Many analytical methods are available to us on the market that each has their own risks and benefits. This paper will help identify some of these key limitations in the methods used for characterizing and evaluating solders, circuit board materials and surface finishes available in the market today.



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