Cleaning High Reliability Assemblies with Tight Gaps, a Detailed AnalysisAuthor: Thomas M. Forsythe
Company: Kyzen Corporation
Date Published: 1/22/2013 Conference: Pan Pacific Symposium
This presents both advanced technology groups and manufacturing engineers with a new process to implement with little tribal knowledge within their organization to base their evaluation on. This paper will study these small gaps and evaluate ionic residues post cleaning by a variety of cleaning agents versus a pair of commonly encountered water soluble fluxing materials. This will allow users to understand the challenges presented by low gap height and the risks associated with various cleaning approaches to remove those residues.
Cleaning, high reliability, ionic residues, gap
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.