The Potential of Stencil Technology - Choosing The Right Stencil Options to Maximize Yield and EarningsAuthors: Harald Grumm and Dominique Graupner
Company: Christian Koenen GmbH - HighTech Stencils
Date Published: 5/14/2013 Conference: ICSR (Soldering and Reliability)
This document introduces stencil technologies, which address these claims and help to increase the first pass yield of your production line:
Layout optimization directly addresses production process issues like tombstones, coplanarity, bridging, solder beading and voiding. Also processes like Through Hole Reflow (THR / PiP) or leadless components (OFN / MLF) should be designed regarding a detailed solder volume calculation.
Step Stencil Technology combines different stencil thicknesses into one stencil, allowing the correct solder volume for each component. Also this technology can be used to implement cavities into the substrate side of the stencil to overcome substrate issues like too high solder resist, too high via filling or plugging, labels or overtop clamping.
3-D-Stencils are capable to print simultaneously on different height levels of a substrate and extend the usability of stencils into new areas.
PLASMA Stencils are coated with a high tech material to enhance paste release, reduce the need for cleaning and minimize the effect of line down times to volume transfer. By choosing the right combination out of the possible options you will be able to speed up your production, enhance your quality and yield.
miniaturization, 3-D stencil, layout optimization, step stencil, plasma coating
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