xFD: A Very Thin Two and Four Die Package Solution for High Performance DDR SDRAMAuthors: Vern Solberg, Simon McElrea, and Wael Zohni
Company: Invensas Corporation
Date Published: 10/14/2012 Conference: SMTA International
For some applications companies have had limited success in vertically stacking SDRAM die elements directly onto an interposer substrate using traditional wire-bond processes. The high performance DDR SDRAM die family, however, are especially difficult to stack. This is due to the center positioned wire-bond sites. This factor has compromized the DRAM die stacking process and because of the excessively long wire-bond interface, functional signal speed can be significantly degraded.
In this paper the authors introduce a very innovative and very thin die-stack package developed specifically for center-bond pad DRAM die. In addition to illustrating the methodology for assembly, data compiled during extensive performance and reliability modeling will be presented along with the results from environmental testing.
DFD, QFD, Die Stack, DDR SDRAM
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