SMTA International Conference Proceedings

xFD: A Very Thin Two and Four Die Package Solution for High Performance DDR SDRAM

Authors: Vern Solberg, Simon McElrea, and Wael Zohni
Company: Invensas Corporation
Date Published: 10/14/2012   Conference: SMTA International

Abstract: To enable the new generations of processors to reach their performance potential many manufacturers have developed more efficient interface formats that provide greater memory bandwidth. This revolution in performance driven electronic systems continues to challenge the IC packaging industry. The challenge is clear. To ensure that the memory functions are able to support the increased signal speed, product developers will need to explore more innovative memory package assembly techniques and process refinement methodologies.

For some applications companies have had limited success in vertically stacking SDRAM die elements directly onto an interposer substrate using traditional wire-bond processes. The high performance DDR SDRAM die family, however, are especially difficult to stack. This is due to the center positioned wire-bond sites. This factor has compromized the DRAM die stacking process and because of the excessively long wire-bond interface, functional signal speed can be significantly degraded.

In this paper the authors introduce a very innovative and very thin die-stack package developed specifically for center-bond pad DRAM die. In addition to illustrating the methodology for assembly, data compiled during extensive performance and reliability modeling will be presented along with the results from environmental testing.

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