Process Control Utilizing Component Risk Mitigation Test Plans
Authors: Andy Buchan, Rachel Garcia, Clifton Aldridge, Jimmy Lucero and Mark Northrup Company: Dynamic Research and Testing Laboratories, LLC and IEC Electronics Date Published: 10/14/2012
Abstract: Component technology is exponentially becoming more and more complex. Couple that with the recently recognized threat of counterfeit components being introduced into our domestic product and we can see that methods of process control are more critical than ever to protect our national security and quality of manufacture. Similar to that of the construction of printed circuit board assemblies (Class 1, 2, 3 products), component test plans can be grouped into categories of low, medium and high risk. If component test plans are not utilized it can lead to detrimental consequences not only for the manufacturer’s reputation but in most extreme cases, threaten the lives of fellow citizens. The recent pass of Bill H.R. 1540, “The National Defense Authorization Act; Section 818”, promises that any Manufacturer found to be utilizing counterfeit parts in their product will legally be held accountable regardless of conscious or unmindful intent. This paper will identify recommended test plans including inspection techniques ranging from External Visual Inspection to Acoustic Microscopy and Fourier Transform Infrared Spectroscopy, and illustrate how the absence of such tests may be consequential. Can you risk the explicit legal prosecution that will result from not utilizing component risk mitigation plans?