SMTA International Conference Proceedings

Lessons Learned in Developing and Optimizing a Select Solder Process for Thermally Challenging Boards

Author: Tom Gervascio
Company: Lockheed Martin
Date Published: 10/14/2012   Conference: SMTA International

Abstract: The increased complexity of many multilayer printed circuit assemblies (PCAs) has resulted in designs that are often difficult or cost prohibitive to wave solder. Selective soldering has become another soldering system that offers advantages for soldering dense, mixed technology boards.

In order to achieve acceptable first pass yields on thermally challenging multilayer boards, it is necessary to understand the select solder process, the machine and it’s interaction with the board while soldering.

Key Words: 

Select solder, wave soldering

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