SMTA International Conference Proceedings


Optimizing PTH Hole-Fill Using Lead-Free Wave Soldering

Authors: Jennifer Nguyen, David Geiger, and Murad Kurwa
Company: Flextronics International
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Hole-fill is the major concern with through-hole component assembly using lead-free wave soldering. This paper presents critical process and design variables that help to improve PTH hole-fill using lead-free wave soldering process. The impacts of process variables such as flux material, flux amount, preheat temperature, pot temperature, contact time will be discussed. It also mentions the influence of the design variables, component and equipment on hole-fill.

Key Words: 

lead-free, through-hole component, wave soldering, process optimization, SnAgCu



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819