SMTA International Conference Proceedings

Optimizing PTH Hole-Fill Using Lead-Free Wave Soldering

Authors: Jennifer Nguyen, David Geiger, and Murad Kurwa
Company: Flextronics International
Date Published: 10/14/2012   Conference: SMTA International

Abstract: Hole-fill is the major concern with through-hole component assembly using lead-free wave soldering. This paper presents critical process and design variables that help to improve PTH hole-fill using lead-free wave soldering process. The impacts of process variables such as flux material, flux amount, preheat temperature, pot temperature, contact time will be discussed. It also mentions the influence of the design variables, component and equipment on hole-fill.

Key Words: 

lead-free, through-hole component, wave soldering, process optimization, SnAgCu

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