Epoxy Fluxes: Dip Assembly Process Issues and ReliabilityAuthors: Pericles A. Kondos, Ph.D., Michael Meilunas, and Martin Anselm, Ph.D.
Company: A.R.E.A. Consortium - Universal Instruments Corporation
Date Published: 10/14/2012 Conference: SMTA International
The assembly process was investigated during the initial stage of this project, and dipping and placement parameters that allowed consistent fluxing were determined. For this early research project only a single material was tested. Two different epoxy flux processing thicknesses were developed for a CSP and a WLCSP of slightly different sizes but the same pitch and ball size. The CSPs were placed on drop testing boards and were subjected to drop or bend tests. Assemblies with the WLCSPs were subjected to accelerated thermal cycling. The reliability performance of all these parts was compared to conventionally-fluxed, non-underfilled assemblies. Failure modes were studied and compared as well. It was seen that epoxy flux could indeed improve the performance as compared to non-underfilled parts if properly applied, but if not it might even reduce reliability.
Epoxy flux, mechanical reliability, drop test, CSP, WLCSP, flux dipping, accelerated thermal cycling
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