Symposium Conference Proceedings

Entek OM, an OSP Alternative High Performance Final Finish

Authors: Jim Kenny, Karl Wengenroth, John Fudala, Melanie Rischka, Dr. Yung Herng Yau
Company: Cookson Electronics Ltd. - Enthone
Date Published: 4/18/2012   Conference: Symposium

Abstract: Increasing cost pressures and the implementation of environmental regulations, such as lead free and halogen free initiatives, have given assemblers significant hurdles to producing reliable PCBAs. Enthone has developed and is continuing to develop a completely new platform of surface finishes based on the Organic Metal technology and has launched the new ENTEK OM process as an alternative to current OSP finishes. This new finish utilizes nanotechnology; the deposited layer is approximately 60 nm, consisting of a complex between the Organic Metal (OM) and silver (Ag). The new surface finish is conductive, halogen free and has excellent solderability. The new nano technology can also significantly improve the environmental and economical consequences of solderable surface finishing.

In this paper the ENTEK OM process will be introduced and its performance properties discussed.

Key Words: 

OSP Alternative, High Performance, Final Finish

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