Symposium Conference Proceedings


Benefits of Inert Gas Soldering for Printed Circuit Board Assembly Processes

Authors: Jerry Wu, Ph.D., Gregory K. Arslanian, and Emily Tan
Company: Air Products
Date Published: 4/18/2012   Conference: Symposium


Abstract: This review of inert atmosphere for the electronics assembly processes will look at the benefits and attempt to close the gap on some of the misconceptions of using inert gases for electronics assembly. We will look at the reasons for using nitrogen and the cost benefits that come with the use of this inert atmosphere gas. As part of this review we will be explain the needs assessment and when you should use an inert atmosphere for your assembly process. Case studies will be provided to demonstrate the benefits of an inert atmosphere in the electronics assembly process area.

Key Words: 

Printed circuit board assembly processes, inert atmospheres, lead-free solders, defect reduction



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