Symposium Conference Proceedings

Overcoming the Challenges of the QFN Package

Authors: Karl Seelig and Kevin Pigeon
Company: AIM
Date Published: 4/18/2012   Conference: Symposium

Abstract: Over the last several years, the electronics assembly industry has witnessed a seismic shift toward component miniaturization. Consumer demands for more functionality in smaller packages have motivated OEMs and Contract Manufacturers to engage in new and innovative technologies. As technological advances usher in a more compact design, a decrease in available board space and more densely populated PCB’s have become increasingly common. In response to these demands, the industry has witnessed a proliferation of Quad Flat No Leads (QFN) packages. The goal of this study is to identify the advantages and challenges that the QFN package brings to the electronics assembly process. This paper will also discuss the results of data evidencing the fundamental steps required to successfully implement QFN technology into an assembly.

Key Words: 

QFN, Challenges

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