Surface Mount International Conference Proceedings


BUMP,DIP,FLIP: SINGLECHIP

Author: George A. Riley
Company: HyComp
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: While research on adhesive flip chip interconnection is growing rapidly, there has been little information available about how to apply this research data to producing practical adhesive flip chip assemblies. This paper describes a simple, flexible inexpensive approach to adhesive flip chip assemblies, beginning with single die, rather than wafers. Results presented are based on more than 750 flip chip assemblies totaling more than 10,000 connections.



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