Surface Mount International Conference Proceedings


Author: George A. Riley
Company: HyComp
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: While research on adhesive flip chip interconnection is growing rapidly, there has been little information available about how to apply this research data to producing practical adhesive flip chip assemblies. This paper describes a simple, flexible inexpensive approach to adhesive flip chip assemblies, beginning with single die, rather than wafers. Results presented are based on more than 750 flip chip assemblies totaling more than 10,000 connections.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819