Room Temperature Debonding - An Enabling Technology for TSV and 3D IntegrationAuthors: Garrett Oakes, Thorsten Matthias, Eric Pabo, Jürgen Burggraf, Daniel Burgstaller, Markus Wimplinger, and Paul Lindner
Company: EV Group
Date Published: 11/5/2012 Conference: IWLPC (Wafer-Level Packaging)
In this paper we describe a new debonding method at room temperature. This new technology decouples the debonding process from the adhesive properties, which creates a de facto material independent debonding standard. As the debonding process does not rely on the adhesive properties a major boundary for adhesive engineering has been removed. The debonding method is compatible with bumps or pillars in the bond interface as well as on the backside of the wafer stack. No force is applied on the bumps during debonding which results in very high yields.
TSV, 3D Integration, Room Temperature Debond
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