Wafer Spray Coating For Pre-Applied UnderfillAuthors: Akira Morita and James Klocke
Company: Nordson ASYMTEK
Date Published: 11/5/2012 Conference: IWLPC (Wafer-Level Packaging)
This paper will demonstrate that using our experience with conformal coating and jet dispensing, we have evaluated wafer spray coating for pre-applied underfill application. This paper will present how we address the thickness consistency and wastage reduction challenges when using wafer spray coating.
3D package, underfill, pre-applied, wafer coating, spray coating, material wastage
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