IWLPC (Wafer-Level Packaging) Conference Proceedings


Optical Profilometry of Substrate Bow Reduction Using Temporary Adhesives

Authors: Paul Flynn and John Moore
Company: FRT of America, LLC and Daetec, LLC
Date Published: 11/5/2012   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Incentives of form factor, performance, and cost reduction are urging the integration of three-dimensional packaging of integrated circuits (3DIC) and promoting thinner substrates. To maintain this trend, new ways of rapid metrology measurement with solutions to achieve substrate bow reduction are needed. FRT’s optical profilometry systems offer high resolution and rapid scanning to map a substrate in minutes [1]. When combined with a removable temporary bonding solutions, simple and low-cost options exist for bow reduction to the end user [2].

Key Words: 

profilometry, bow, warp, TTV



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