Adaptive Patterning For Panelized PackagingAuthors: C. Scanlan, B. Rogers, T. Olson, C. Bishop, J. Kellar, and B.Y. Jung
Company: Deca Technologies, Inc.
Date Published: 11/5/2012 Conference: IWLPC (Wafer-Level Packaging)
This paper describes an approach to FOWLP that allows die offset to increase by an order of magnitude compared with conventional methods. Using a novel Adaptive Patterning* technology, real-time designs are created for each package within each panel during the manufacturing process. After panelization, the position of each die within each molded panel is precisely measured. Information is fed into a proprietary auto-routing design tool on a per panel basis. The resulting pattern layers are then issued to a lithography system which dynamically implements the unique design on a per panel basis. Dynamic layers include various design features such as vias or redistribution layers (RDL).
The ability of adaptive patterning to correct for deviations in die location can result in both improved yield and higher panelization throughput, thereby enabling the industry to finally realize the cost, flexibility, and form factor benefits of FOWLP. In the paper, adaptive patterning examples will be presented and the benefits and limitations of the technology will be discussed.
adaptive patterning, fan-out wafer-level packaging (FOWLP), panelized packaging, WLP
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