A Study of a Development Lithography Processes for 3Di Plating ApplicationsAuthors: Patrick Kearney, Kirsten Ruck, Kathleen Nafus, Tetsushi Miyamoto, Patrick Jaenen, and Andrew Miller
Company: Tokyo Electron Europe Limited, Tokyo Electron Kyushu Limited, Inter-University Micro-Electronics Centre
Date Published: 11/5/2012 Conference: IWLPC (Wafer-Level Packaging)
This paper aims to show a comprehensive developing study into 60µm photoresist films applied to a 3D plating process on 300mm wafers. The end result being the determination of control knobs that facilitate a more efficient and controlled.
3Di, Films for Plating. Developing thick photoresist films
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