Surface Mount International Conference Proceedings


Author: Don Revelino
Company: Packard Bell NEC
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: In the past, most experts would agree that a world-class printed circuit board surface mount manufacturing operation should achieve 50 defects per million opportunities (DPMO) at the solder joint level. With current technology, obtaining a defect rate of less than 10 DPMO is now an achievable goal. In today’s environment, a well-defined quality information system with real-time, accurate, statistical data is essential in driving process improvements; yet, the quality information system itself is not enough. If “world class” DPMO solder process barriers are to be broken, all variables that could effect the process must be understood, analyzed and optimized. This paper will present a case study of how Packard Bell NEC reached single digit DPMO in the SMT solder process. It will describe the measurements, analysis and actions taken to achieve this goal. It will give examples of real data, materials analysis, and supplier interactions that were used to incrementally improve the SMT solder process yields.

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