THE NEW IPC HDI (MICROVIA) DESIGN GUIDELINE (IPC-2315)Author: Happy Holden
Company: TechLead Corp.
Date Published: 9/12/1999 Conference: SMTA International
This paper describes the new design guide and the various design rules for different HDI structures. The topics covered are: Definitions and classification of microvias Density evaluation and routability predictions , with/examples Material selection and specifications Type I HDI Structure, alternatives and design rules Type II HDI Structure, alternatives and design rules Type III HDI Structure, alternatives and design rules Staggered vias, via-in-pad design rules Special HDI design rules (stacked vias, co-lamination and conductive pastes)
This paper complements the other two new IPC HDI standards, IPC-4104 Specification for HDI Materials and IPC-6016 Qualification and Performance Specification for HDI.
Key words: IPC Standards, HDI design, Wiring Density
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.