Bonding and Contacting of Vertically Integrated 3-D MicroscannersAuthors: M. Wiemer, J. Frömel, C. Jia, S. Bargiel, M. Baranski, N. Passilly, and C. Gorecki
Company: Fraunhofer Institute for Electronic Nanosystems (ENAS) and FEMTO-ST Institute UMR CNRS 6174
Date Published: 11/5/2012 Conference: IWLPC (Wafer-Level Packaging)
We demonstrate the 3-D stacking technology, based on sequential multi-level anodic bonding, successfully tested with deeply structured silicon/glass wafers. In addition, the through wafer vias (TWV) technology is employed to establish electrical connection from the top to the bottom through a stack of two SOI wafers, one glass wafer and one ceramic wafer. Presented methods are of general importance for various silicon-based vertically integrated devices.
MOEMS; optical micro scanner; assembly technology; vertical integration; bonding; glass micro lens
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.