IWLPC (Wafer-Level Packaging) Conference Proceedings

Bonding and Contacting of Vertically Integrated 3-D Microscanners

Authors: M. Wiemer, J. Frömel, C. Jia, S. Bargiel, M. Baranski, N. Passilly, and C. Gorecki
Company: Fraunhofer Institute for Electronic Nanosystems (ENAS) and FEMTO-ST Institute UMR CNRS 6174
Date Published: 11/5/2012   Conference: IWLPC (Wafer-Level Packaging)

Abstract: In this work we describe the bonding and contacting of a micromachined vertically integrated 3-D microscanner, which is a key-component for a number of scanning imaging microsystems, such as confocal microscopes onchip or optical coherence tomography (OCT) probes for micro endoscopy. The 3-D microscanner is composed of two electrostatic silicon MEMS micro actuators which are vertically aligned and bonded with glass and ceramic components to create hermetically sealed cavity for scanning microlenses.

We demonstrate the 3-D stacking technology, based on sequential multi-level anodic bonding, successfully tested with deeply structured silicon/glass wafers. In addition, the through wafer vias (TWV) technology is employed to establish electrical connection from the top to the bottom through a stack of two SOI wafers, one glass wafer and one ceramic wafer. Presented methods are of general importance for various silicon-based vertically integrated devices.

Key Words: 

MOEMS; optical micro scanner; assembly technology; vertical integration; bonding; glass micro lens

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