IWLPC (Wafer-Level Packaging) Conference Proceedings


Single Sided Wet Etching For Texturing, Thinning and Packaging Applications

Authors: Ricardo I. Fuentes, Ph.D.
Company: Materials and Technologies Corp. (MATECH)
Date Published: 11/5/2012   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The advancement of wafer thinning and surface treatment technologies has been somewhat limited by the methods commonly employed; namely immersion, spin, or spray etching. All these technologies suffer from inherent transport characteristics that result in non-uniformity, limitations in the minimum thickness attainable, and lack of process flexibility.

We will report on results produced by a new technology that has been gaining momentum over the last few years: Linear Scanning. It is inherently single-sided and more uniform as well as cost effective and flexible.

LinearScan etching technology exposes only the process side of the substrate to a thin line of flowing chemicals and scans in a continuous, repeating sequence as many times as necessary to achieve the desired results. The process time is similar to that required by the same chemistry with a conventional method.

The non-process side and edges of the wafer are protected from the etchant by a shaped gas flow making it a truly singled process. Without the dynamics involved in spinning, spraying or immersion techniques, this technology is suitable for very thin wafers, fragile materials, or delicate structures such as those used in 3D packaging and solar applications. The non-process side can be bumped, taped, patterned or otherwise structured and is not affected by the process. Common Linear Scan applications include texturing, thinning, stress relief, among others.

Key Words: 

Texturing, Chemical Thinning, Etching, Stress Relief, WaveEtch, Linear Scan



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