Surface Mount International Conference Proceedings


OPTIMIZATION OF VOIDS IN SOLDER JOINTS AT BOARD-LEVEL BGA ASSEMBLY

Author: Sarathy Rajagopalan
Company: Solectron Corporation
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: PBGA packages have increased in popularity and now have become commonplace in many board level assembly operations. A concern in industry is the formation of voids in eutectic PBGA solder joints. A Design of Experiment (DOE) was initiated to determine the control parameters of void creation on PBGA assembly. A test vehicle with multiple PBGA packages totaling over 3000 BGA 1/0s was chosen. The two designs came from two different suppliers. One was an overmolded cavity-up design and the other was cavity-down. The solder paste was held constant as it was the approved solder paste of choice in manufacturing. The control parameters chosen for the DOE were the soak and reflow temperature zone settings and the conveyor speed. The results of the 15 DOE runs showed varying degree of voiding. The void responses for the BGA suppliers were drastically different. However when verifying the “sweet spot” regions, all packages resulted in nearly zero voids.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819