IWLPC (Wafer-Level Packaging) Conference Proceedings


Heterogeneous Packaging for MEMS

Author: Matt Apanius
Company: Desich SMART Center
Date Published: 11/5/2012   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Slides only, no paper. From Panel Discussion.

Key Words: 

MEMS



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819