IWLPC (Wafer-Level Packaging) Conference Proceedings

MEMS Hermeticity and Reliablility Testing Today

Author: Michael Shillinger
Company: Innovative Micro Technology
Date Published: 11/5/2012   Conference: IWLPC (Wafer-Level Packaging)

Seika Machinery, Inc.

Abstract: Winner of 2012 IWLPC Best of Conference!

Successful wafer-level packaged MEMS devices need hermeticity and reliability testing to prevent failure from particles, contamination, moisture, among other factors. Unfortunately, legacy hermeticity test protocols fail when applied to the measurement of micron-sized volume of cavities, where MEMS devices typically reside. Recently, higher resolution and more accurate test methods have evolved in market. When combined with standard reliability tests, MEMS manufacturers can ensure they ship high quality products.

Reliability is a critical parameter to take into consideration; if a product does not deliver the design performance during its expected lifetime it cannot be commercialized. Reliability in MEMS devices is particularly important because failure can be time consuming and costly.

Assurance of reliability involves intelligent design, reliable test strategies, and accurate testing techniques. Selecting the right test(s) depends on the MEMS device and how the device needs to perform in the field. Engineers cannot design reliable MEMS without first understanding the factors that can lead to failure and how to test for these factors.

Key Words: 

MEMS, Hermeticity, Reliability, Testing

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