SMTA International Conference Proceedings


Understencil Wiping: Does It Benefit Your Process?

Authors: David Lober, Mike Bixenmen, D.B.A, Chrys Shea, and Ed Nauss
Company: Kyzen Corporation, Shea Engineering Services, and Speedline Technologies
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Understencil wiping has gained an increase in interest over the last several years. Changes in circuit designs, such as miniaturized components, increased density of components, and new stencil technology, as well as changes in and increased attention to employee safety and environmental regulations have driven renewed interest. New understencil wipe solvents have been introduced recently to address these issues. However, little to no quantitative data exists on how these new solvents benefit the printing process, specifically, yields, transfer efficiencies and print volume repeatability. The lack of data has led to slow adoption of understencil wipe cleaning solvents, as there is no proof that the costs justify their benefits. This paper quantitatively examines the effect of various combinations of solvents, wiping frequency, and pastes in a way that is relevant to both process engineers and the bottom line.

Key Words: 

Printing, Cleaning, Nano coating, under stencil wipe, solvent



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