Influence Of Printer Settings On Step Stencil DesignAuthors: Carmina Läntzsch and Georg Kleemann
Company: LaserJob GmbH
Date Published: 10/14/2012 Conference: SMTA International
Step stencils are general required to adjust the solder paste volume for specific components by using different stencil foil thicknesses in one stencil. The step-down stencil for example is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencils produced by LaserJob show some unique advantages and are developed for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
stencil printing, step-up/step-down stencils, transfer efficiency
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