Surface Mount International Conference Proceedings


VALIDATING THEORETICAL CALCULATIONS OF THERMOMECHANICAL STRESS AND DEFORMATION USING THE ATC4.I FLIP-CHIP TEST VEHICLE

Author: David W. Peterson
Company: Sandia National Laboratories
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Two closed form analytical solutions for tri-material thermomechanical stress and deformation, along with a one-quarter section finite element model (FEM), were validated using an in-situ CMOS piezoresistive stress measurement test chip that has been repatterned into a fine pitch area array flip-chip. A special printed circuit board substrate for the test chip was designed at Sandia and fabricated by the Hadco Corp. The flip-chip solder attach (FCA) and underfill was performed by a SEMATECH member company. The measured incremental stresses produced by the underfill are reported and discussed for two underfill materials used in this experiment. Detailed comparisons between theory and experiment are presented and discussed. KEY WORDS flip chip, piezoresistor stress measurement, die stresses



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