SMTA International Conference Proceedings


Simple, Fast High Reliability Rework of Leadless Devices

Author: Bob Wettermann
Company: BEST Inc.
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Recently, the impact of leadless device reliability after rework was investigated as part of a NASA/DoD project for different leadless device rework processes. Leadless device packages, which are challenging to rework due to their large thermal ground planes, low standoff heights from the PCB and the lack of visually inspected criteria, were investigated in terms of their long term reliability after rework. Several leadless device rework methods, including the latest rework procedure (stay in place stencil)1 were investigated in this study. The study, commissioned by Naval Surface Warfare Center (NSWC), Crane Division was attempting to answer the question: "to what extent do rework procedures, including SnPb and lead-free mixed solder joints affect solder joint reliability of high-performance electronics."

Key Words: 

QFN rework, QFN reliability, leadless devices, bottom terminated device rework



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