Evaluation Of Phase Change Thermal Interface Materials By In-Situ Methods and Their Application Dependent Performance ParametersAuthor: Scott T. Allen
Company: Henkel Electronic Materials, LLC
Date Published: 10/14/2012 Conference: SMTA International
Over the last decade, there have been significant advances in thermal interface materials, however when it comes to evaluating their performance in actual applications, there is often much confusion. Standardized test methods which only measure the bulk material properties have been discounted over time, while the increased use of in-situ thermal test vehicles has proven highly valuable in creating a more realistic view of TIM performance. Even with in-situ methods, however, there still exists some misunderstandings on how to properly evaluate PCTIMs in order to select the correct material for a given application.
In this paper we present data measuring the thermal resistance of a high performance PCTIM during in-situ operations and demonstrate how steady state thermal resistance measurements do not provide a complete picture of the thermal excursions experienced by the device and heatsink under powered burn-in operations. We will also present data showing the effects from the application and test methods (TIM thickness; device power/heating rate) and offer guidelines on controlling specific PCTIM parameters in order to optimize the total system thermal performance.
thermal interface material, TIM, phase change, thermal conductivity, thermal impedance
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