SMTA International Conference Proceedings

Considerations For Reduced Cost Micro Array Component Rework

Author: Edward Zamborsky
Company: OK International
Date Published: 10/14/2012   Conference: SMTA International

Abstract: This paper will provide an introduction to component types as well as the evolution of package sizes and how to rework them using a cost effective and high reliability techniques.

Micro Ball Grid Array Packages (µBGA) are rapidly becoming the package of choice when designing new PCB assemblies. These packages generally offer high, first-pass process yields with significant real estate savings over their predecessors. Process or design errors occasionally require the need for rework. Because rework will require the removal of the component, special considerations must be taken into account. For instance: excessive heat, improper removal, site-cleaning techniques have the potential to cause damage to surrounding lands, other components, or the PCB itself. In short, proper rework requires sound practices, proper tools and quality training.

This session will instruct the attendee on how to correctly identify different types of components and the different rework considerations that must be taken into account when using a specific type of Array Package. The attendee will then receive instruction on the latest strategies for handling the 5 main steps of Array rework: Thermal Profiling, Removal, Site Cleaning, Site Preparation, and Replacement.

Key Words: 

µBGA, PB-free, rework, reflow, LGA, micro ball grid array, flux dip, dual-zone, subzone, direct power

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