Overcoming Head-In-Pillow Defects In Hybrid LGA Socket AssemblyAuthors: Marie Cole, Theron Lewis, Jim Bielick, PK Pu, Stephen Hugo, Phil Isaacs, Eddie Kobeda, Matt Kelly, Su Bing, Alex Chen, James Huang, Kevin Liu, John McMahon, Brian Standing
Company: IBM Corporation and Celestica Inc.
Date Published: 10/14/2012 Conference: SMTA International
This paper will discuss the optimization of the assembly process for this complex printed circuit board assembly (PCBA). Several design of experiments were evaluated, including solder paste chemistry, stencil parameters, vapor phase reflow profile settings and reflow fixture design. Additionally, the contribution of incoming connector tolerances and thermal dynamic warpage were considered. There was also implementation of containment actions to prevent any escape of head in pillow defects.
HIP, head in pillow, head on pillow, high complexity SMT, soldering defects
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