Lead-Free SMT Connector Process Exposure, Reliability, Quality, and Yield Assessment For High Thermal Mass AssembliesAuthors: Jimmy Chow, John McMahon, Heather McCormick, Russell Brush, Vejeyathaas Thambipillai, Kok Wei Khoo, Matt Kelly and Marie Cole
Company: Celestica Inc. and IBM Corporation
Date Published: 10/14/2012 Conference: SMTA International
A new test vehicle was designed and assembled to study a wide range of connectors for lead-free process assembly and forced rework operations. Solder joint degradation under accelerated thermal cycling was studied for four different connectors. Results are discussed for GIG-Array®, SEARAY™, SlimStack™ connectors and for a Hybrid LGA Socket configuration. In order to in-situ monitor the Hybrid LGA Socket, a daisy-chained LGA Hybrid Interposer was designed and manufactured to simulate an actual LGA. A full mechanical heat sink assembly was mounted around the LGA socket to ensure that cyclic testing was performed under the actual compression stresses that are seen in production level designs. The test vehicle assemblies were preconditioned with shock and vibration prior to accelerated thermal cycling.
Test vehicle design, assembly process parameters, solder joint yield, stress test results, and failure analysis will be presented for this high thermal mass lead-free SMT assembly.
SMT connectors, lead-free, primary attach, rework, plastic housing survival, solder joint reliability.
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