SMTA International Conference Proceedings

Compliant Pin Interconnect Challenging and Reliability After January/1/2012 RoHS Exemption

Authors: David He, Yu Xiang, DF Chung, Paul Wang, Ph.D., Livia Hu, Bobby Dayal, Karl Sauter, Tim Norman, and Jorge Martinez-Vargas
Company: Mitac International Inc. and Oracle Corporation
Date Published: 10/14/2012   Conference: SMTA International

Abstract: The RoHS exemption for tin/lead coating on compliant pin connectors will be removed on Jan 1, 2013. The compliant pin connector manufacture process in motherboard assembly becomes more and more challengeable with the conversion to lead-free pin plating. Literature on the pin plating process focused mainly on matte tin and compliant pin connectors are not immune to the defect of bent pin and copper wall broken even with relatively soft tin/lead plating. In this paper, a test vehicle is designed with specific focuses on different compliant pin plating finish, different PCB drill hole size (DHS) and different board surface finish. How these relevant design and materials characteristics contribute to the compliant pin press process defect will be elaborated. Finally, potential solution which will be evaluated and characterized to eliminate the defect in compliant pin press process and it's interconnect reliability will be discussed. Interconnect reliability of the new finish system will be also presented.

Key Words: 

compliant pin, press fit, lead-free, DHS, plating, surface finish

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