Latest Developments In Testing Pb-Free Electronic Assemblies: A Report On The Revision A Update To GEIA-STD-0005-3
Author: Anthony J. Rafanelli Company: Raytheon Integrated Defense Systems Seapower Capability Center Date Published: 10/14/2012
Abstract: Since the inception of the European Union Restriction on the use of Hazardous Substances in July of 2006, use of Pb-free materials has continued to increase throughout the electronics industry. While these materials have operated acceptably in many consumer products and other applications (in relatively benign conditions), the defense and aerospace industry continues to monitor Pb-free implementation while maintaining as well as developing risk mitigation approaches based on predicted performance shortfalls. In June of 2008, GEIA-STD-0005-3, Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes, was released to provide some discipline as well as much-needed guidance in testing electronic assemblies utilizing Pb-free solder interconnections. Since that time, the Pb-free knowledge base has increased resulting in a somewhat paradoxical situation, i.e. while some original questions have been answered, a great more questions have arisen. Almost upon its immediate release, the GEIA-STD-0005-3 development team realized that a near-term revision was imminent. Subsequently, release of Revision A (scheduled for calendar year 2013) is nearing completion addressing updates in test fidelity, room temperature effects, component damage, failure mechanisms, combined environments, strategies for assessing future alloys, and other topics. This paper will discuss these changes as well as present some additional insight into Pb-free test considerations and issues.