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SMTA International Conference Proceedings


Solder Alloy Creep Constants For Use in Thermal Stress Analysis

Authors: Robert Darveaux and Corey Reichman
Company: Amkor Technology, Inc.
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Creep constants were determined by conducting mechanical tests on solder joint array specimens. Either double lap shear or tensile loading was employed. Thirty combinations of alloy, pad metallization, and joint size were characterized. The test temperature range was from -55C to 134C. The strain rate range was from 10-8/sec to 10/sec. The stress range was from 0.1MPa to 100Mpa. All of the data sets were fit to the same basic constitutive relation.

Note: This paper was presented as part of the Lead Free Soldering Technology Symposium during SMTA International.
Click here to download complete video recordings of the entire symposium.

Key Words: 

creep constants, thermal stress



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