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SMTA International Conference Proceedings


iNEMI Pb-Free Alloy Characterization Project Report: Part I - Program Goals, Experimental Structure, Alloy Characterization, and Test Protocols For Accelerated Thermal Cycling

Authors: Gregory Henshall, et al.
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Significant innovations in Pb-free solder alloy formulations are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys first established as replacements for Sn-Pb. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as poor mechanical shock performance, but also introduces a variety of technical and logistical risks. Since 200, the Pb-Free Alloy Characterization Program sponsored by the International Electronics Manufacturing Initiative (iNEMI) has been working to fill the gap in knowledge associated with thermal fatigue resistance of these new solder alloys.

Results from the extensive experimental program are now becoming available and will be published through a series of publications over the next 1-2 years. The purpose of this first paper in the series is to provide the industry with an understanding of the overall program goals, and the experimental structure and details. Subsequent papers will focus on presenting results, analyses, and conclusions from selected portions of the study.

Note: This paper was presented as part of the Lead Free Soldering Technology Symposium during SMTA International.
Click here to download complete video recordings of the entire symposium.

Key Words: 

Solder alloys, lead free solder, thermal cycle reliability, thermal cycle testing, low silver alloys



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