SMTA International Conference Proceedings


New Interconnection For High Temperature Application: HotPowCon (HPC)

Authors: Jörg Trodler, Mathias Nowottnick, Andreas Fix, and Timo Herberholz
Company: Heraeus Materials Technology GmbH & Co. KG, University of Rostock, and Robert Bosch GmbH
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Based on the trend for new technology in the automotive market including high power modules for e-mobility, and a combination of logic and power which will be developed for the future market with economic, safety and reliability effects.

One of the most important challenges are electrical systems and the realization of complete energy management. The connection between sensor, logic and control units, as well as power transmission for electrical vehicles, is the assembling technology for electronics (eAVT). Current materials and manufacturing processes are limited for these combinations.

The paper will discuss and shows results after a one year project run, which is being financed by the German government showing modification of materials and manufacturing processes for temperature resistance of app. 300°C.

Therefore, it will present the basis of the material and the realization for processes as well as functional devices for the eAVT. The project group comprises of the following: Robert Bosch, Heraeus Materials Technology, Seho Systems, Siemens, Chemnitzer Werkzeugmechanik, two Fraunhofer Institutes (IZM and ENAS), University of Rostock, Technical University of Dresden, Daimler and Volkswagen (VW).

Key Words: 

HotPowCon (HPC), eAVT, assembling technology for electronics, automotive



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