Surface Mount International Conference Proceedings


SMT COMPONENT SELF-CENTERINGPROPERTIES DURING SOLDER REFLOW

Author: Richard Noreika
Company: IBM Corporation
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Surface Mount Technology (SMT) componentry has experienced a vast proliferation over the past decade, including the introduction of package names such as QFP, TSOP, BGA, CSP, and the chip carrier elimination strategy of FCA. Mass soldering of these devices to printed circuit boards has kept pace through increased precision and control, coupled with the benevolent solder reflow attribute that compensates for misplaced components. But do all of these packages selfcenter to an equal degree when misplaced? What about the nuances associated with the subgroups of each device family, such as component mass and lead characteristics? And does solder surface tension behave uniformly within a subgroup as the quantity of soldered interconnections change? Answers to these questions are critical in establishing the placement requirements for a robust assembly process. Keywords: component /self-centering / alignment



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