Reliability Assessment of a SMT Assembly With Prediction of Its Board-Level Interconnect Life DistributionAuthors: Jingsong Xie, Ph.D., Haiyu Qi, Ph.D., Jun-Ke Zhang, Feng-Hua Zhou, Chun-Yong Tang, Jaccy Wang, Ding-Jun Xie, Li-Li Chen, and Chang Wang
Company: RelEng Technologies, Inc., Huawei Technologies Co., Ltd., and Beihang University
Date Published: 10/14/2012 Conference: SMTA International
Both temperature variation induced thermal fatigue and random vibration induced high-cycle fatigue are considered in the assessment. Solder interconnects subject to potential failures in field are identified based on fatigue life prediction results obtained from the analysis. Despite the fact that testing environmental conditions are used in the analysis instead of actual usage profiles, this study indicates a potential risk of the current design of the assembly under investigation in failing to meet the targeted product life requirement of 15 years in field.
Electronic Assemblies, Finite Element Analysis, Ball Grid Array Interconnect, Life Prediction, Failure Models
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.