SMTA International Conference Proceedings

Reliability Assessment of a SMT Assembly With Prediction of Its Board-Level Interconnect Life Distribution

Authors: Jingsong Xie, Ph.D., Haiyu Qi, Ph.D., Jun-Ke Zhang, Feng-Hua Zhou, Chun-Yong Tang, Jaccy Wang, Ding-Jun Xie, Li-Li Chen, and Chang Wang
Company: RelEng Technologies, Inc., Huawei Technologies Co., Ltd., and Beihang University
Date Published: 10/14/2012   Conference: SMTA International

Abstract: This paper presents a case study of interconnection reliability assessment of a SMT assembly. A predicted usage life distribution of the SMT interconnects of the assembly under investigation is obtained using a simulation and model based approach. The analysis involves 20 BGA and 6 leaded QFP/SOP packages on board. Both types of solder joints in the total number of over 8,000, including the solder ball interconnections of the BGA packages and the gull-wing type SMT solder interconnections of the leaded packages, are modeled and analyzed in this study. With a computer aided approach, an efficient process of design data conversion and FEA modeling is achieved making the approach suitable for implementation in a typical industrial design & development environment.

Both temperature variation induced thermal fatigue and random vibration induced high-cycle fatigue are considered in the assessment. Solder interconnects subject to potential failures in field are identified based on fatigue life prediction results obtained from the analysis. Despite the fact that testing environmental conditions are used in the analysis instead of actual usage profiles, this study indicates a potential risk of the current design of the assembly under investigation in failing to meet the targeted product life requirement of 15 years in field.

Key Words: 

Electronic Assemblies, Finite Element Analysis, Ball Grid Array Interconnect, Life Prediction, Failure Models

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