SMTA International Conference Proceedings

Reliability of Passive and Active Components With Differences According To Lead-Free Paste Characterization

Authors: Jörg Trodler, Heinz Wohlrabe, Ph.D., and Rüdiger Knofe
Company: Heraeus Materials Technology GmbH & Co.KG, Technische Universität Dresden, and Siemens AG
Date Published: 10/14/2012   Conference: SMTA International

Abstract: Based on the last year SMTAI paper “Lead-Free Paste Characterization (Wetting & Voiding) Versus Reliability" further components have been analyzed according to shear stress and cracks in the solder joint.

The paper compares different flux and solders paste formulations in terms of the wetting properties, void formation and reliability results for active and passive components. For passive components it compares pure Ni finish with Sn finishes. Therefore, the shear stress was analyzed under automotive requirements.

The test conditions used in the testing procedure were temperature cycling with different parameters in terms of deltaT: -40°C/+125°C (30'/10"/30'). Data is available for 2000 cycles.

The Active Components were also tested with this testing procedure. These components have a different finish termination like Sn and NiPdAu/Ag for LQFPs as well as eutectic SnAg and SAC balls for BGAs. The analysis was made by cross section and measured the crack length after cycling.

The results and influences for the quality of assembled PCB will be discussed during the presentation and a critical review will be formulated for possibilities to transform test to field conditions together with further demands for generating lifetime results based on the defect identification.

Key Words: 

Lead-Free, Reliability, Passives, Actives

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