SMTA International Conference Proceedings

Process Development For Micro-Electronics Packaging With Direct Printed Additive Manufacturing

Authors: R. X. Rodriguez and K. Church, Ph.D., X. Chen
Company: University of Texas at El Paso and nScrypt Inc.
Date Published: 10/14/2012   Conference: SMTA International

Abstract: Next generation electronics will not change drastically in function; batteries will last longer, devices will have more functions and devices will take unique shapes, but for the next several years, electronics will travel the path it has been traveling for a couple of decades. To meet the demands of more functions per device and unique shapes, the status quo of electronic manufacturing cannot persist. Solder, wire bonds, FR4, printed circuit boards, surface mount and packaging will fight for survival, but just as hand held phones have evolved, so will the electronics that support them. Standard electronic packaging techniques are reaching size and density limits forcing a search for alternative approaches. The idea of using Additive Manufacturing as an alternative for packaging has not been taken seriously, but there is an opportunity to demonstrate the significant advantages of true 3D electronic packages by allowing the package to be the printed circuit board and by utilizing direct print and bare die approaches to print and structure diverse electronics.

Key Words: 

Additive Manufacturing, Printed Circuit Board, Direct Print, 3D Structure

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819