Surface Mount International Conference Proceedings


Author: P. Nerio
Company: MicroModule Systems
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: A high performance flip chip / BGA packaging concept utilizing standard fab processes and an additional substrate “decal” process has been developed. This new FC/BGA package provides increased I/O (>1000) and reduced power/ground inductance over conventional flex or chip scale packages. The decal is the functional interface between the flip chip die to the PCB through fine pitch routing. The thin (60 pm) and compliant decal is attached to a frame, and serves to decouple the die from the frame reducing thermal mismatch effects and increasing reliability. Several test vehicles have been developed utilizing this new packaging concept. Key words: Flip substrate

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