Effect of Solder Paste and Flux Type On Board Level Reliability of a 3D Wafer Level Chip Scale PackageAuthors: Fei Xie, Ph.D., Daniel F. Baldwin, Ph.D., Paul N. Houston, and Brian J. Lewis
Company: Engent, Inc.
Date Published: 10/14/2012 Conference: SMTA International
Robust yield and solid reliability performance were indicated for the second level assembly process under various conditions and in a 5000 air-to-air thermal cycle (-40?C to 125?C) testing on assembled packages. The impact of select solder pastes, flux types and different underfill methodologies on overall reliability are discussed in this paper, the detailed analysis for the different failure modes and root causes will be addressed. In addition, the best solder paste and underfill were selected after comparing the second level reliability results. Combined with the previous first level yield and reliability results, the reliability assessment on the second level package assembly shows that the structured 3D-WLCSP packages can be fabricated with robust yields and demonstrate high reliability.
3D Wafer Level CSP (WLCSP), Solder paste, Assembly process, Second level reliability, Failure mode
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