SMTA International Conference Proceedings


3D Technology - A Promising Approach in The Field of Smart System Integration

Authors: M. Juergen Wolf and Klaus-Dieter Lang
Company: Fraunhofer IZM and All Silicon System Integration
Date Published: 10/14/2012   Conference: SMTA International


Abstract: System in Packages (SiPs) are driving today's packaging and heterogeneous system integration techno-logies. Besides already established approaches, new ap-proaches are coming up which are aligned to the needs of future smart products. According to different application areas e.g.

  • Logic
  • Logic/Analog
  • Sensors including MEMS and image sensors
  • RF
  • Power
  • Lighting
  • Very specialized solutions are required to fulfill the technical needs and also to allow a cost effective realization. Traditional packaging solutions are not able anymore to deal with the required performance e.g. com-munication demands with high data transmission speed, heat removal, power delivery or multi-device integration as stated in the ITRS roadmap.

    Key Words: 

    3D, System in Package, SiP, ITRS



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