3D Technology - A Promising Approach in The Field of Smart System IntegrationAuthors: M. Juergen Wolf and Klaus-Dieter Lang
Company: Fraunhofer IZM and All Silicon System Integration
Date Published: 10/14/2012 Conference: SMTA International
Very specialized solutions are required to fulfill the technical needs and also to allow a cost effective realization. Traditional packaging solutions are not able anymore to deal with the required performance e.g. com-munication demands with high data transmission speed, heat removal, power delivery or multi-device integration as stated in the ITRS roadmap.
3D, System in Package, SiP, ITRS
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.