SMTA International Conference Proceedings

Electroless Ni/Pd/Au Plating For Cu Wire Bonding

Authors: Yoshinori Ejiri, Takehisa Sakurai, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa
Company: Hitachi Chemical Co., Ltd.
Date Published: 10/14/2012   Conference: SMTA International

Abstract: We investigated the copper wire bonding reliability of electroless Ni/Pd/Au plating, electroless Ni/Au plating, and electrolytic Ni/Au plating on a semiconductor package substrate, comparing with the gold wire bonding. We found that the minimum gold thickness of electroless Ni/Pd/Au for the reliable copper wire bonding was 0.1 µm with a 0.1 ?m thick Pd film, and 0.2 ?m with a 0.03 ?m thick Pd film. For electroless Ni/Au and electrolytic Ni/Au, the minimum gold thickness was found to be 0.3 µm. These results indicate that electroless Ni/Pd/Au has the advantage of a lower minimum gold thickness over electroless Ni/Au and electrolytic Ni/Au for copper wire bonding. Thus, we have established electroless Ni/Pd/Au plating technology as beneficial in terms of cost and the amount of gold required for reliable copper wire bonding.

Key Words: 

Electroless Ni/Pd/Au, Cu wire, Wire-bonding reliability, Heat treatment, Grain size, Grain boundary diffusion

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819