SMTA International Conference Proceedings


PCB Assembly Process Development and Characterization Of 0.3mm µCSP Packages

Authors: Wu WeiPing (Jonathan), Restyfonte Familara, L.M. Lim, Mohd Yusuf, Hien Ly, and Chrys Shea
Company: Jabil Circuit, Inc. and Shea Engineering Services
Date Published: 10/14/2012   Conference: SMTA International


Abstract: 0.3mm pitch is the next level of miniaturized area array packages for mobile and wireless devices. The components may be attached to the PCB by a variety of methods that include stencil printing solder paste or dipping the balls in either solder paste or tacky flux, and then reflowing. Following PCB attachment, they must be inspected, and depending on the application underfilled, tested and possibly reworked as part of the PCB assembly process.

This paper reviews the assembly process development project for 0.3mm devices. It addresses the test vehicle, process options, material selection, inspection and analysis methods, and discusses considerations of the individual aspects of the assembly process.

Key Words: 

0.3mm, CSP, microCSP, WLP, microBGA



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