PCB Assembly Process Development and Characterization Of 0.3mm µCSP PackagesAuthors: Wu WeiPing (Jonathan), Restyfonte Familara, L.M. Lim, Mohd Yusuf, Hien Ly, and Chrys Shea
Company: Jabil Circuit, Inc. and Shea Engineering Services
Date Published: 10/14/2012 Conference: SMTA International
This paper reviews the assembly process development project for 0.3mm devices. It addresses the test vehicle, process options, material selection, inspection and analysis methods, and discusses considerations of the individual aspects of the assembly process.
0.3mm, CSP, microCSP, WLP, microBGA
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