Fine Pitch (0.4 mm) TMV Package On Package Assembly In AirAuthors: Rafael Padilla, Yutaka Hashimoto, Satoru Akita, Derek Daily, Tokuro Yamaki, Takayuki Yoshida, and Masato Shimamura
Company: Senju Comtek Corporation and Senju Metal Industry Co., Ltd.
Date Published: 10/14/2012 Conference: SMTA International
The goal of this study is to verify what material(s) and production process provides a robust assembly window for next generation, fine pitch (0.4mm), PoP packages with TMV in air.
TMV (Through Mold Via), PoP (Package-on-Package), Halogen Free
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