SMTA International Conference Proceedings


Fine Pitch (0.4 mm) TMV Package On Package Assembly In Air

Authors: Rafael Padilla, Yutaka Hashimoto, Satoru Akita, Derek Daily, Tokuro Yamaki, Takayuki Yoshida, and Masato Shimamura
Company: Senju Comtek Corporation and Senju Metal Industry Co., Ltd.
Date Published: 10/14/2012   Conference: SMTA International


Abstract: Next generation, fine pitch, package on package (PoP) components with through mold vias (TMV) have been widely adopted as a solution in the handheld potable device industry and are gaining traction in additional markets, as manufacturers look for ways to increase reliability, functionality and miniaturization, to meet the demands of consumer products. However, the adoption of the TMV on fine pitch packages has also raised technical challenges with single pass (on-board stack) air reflow using halogen free materials.

The goal of this study is to verify what material(s) and production process provides a robust assembly window for next generation, fine pitch (0.4mm), PoP packages with TMV in air.

Key Words: 

TMV (Through Mold Via), PoP (Package-on-Package), Halogen Free



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