LGAs VS. BGAs - Lower Profile And Better ReliabilityAuthors: S. Joshi, B. Arfaei, A. Singh, M. Gharaibeh, M. Obaidat, A. Alazzam, M. Meilunas, L. Yin, M. Anselm, and P. Borgesen
Company: Binghamton University and Universal Instruments Corporation
Date Published: 10/14/2012 Conference: SMTA International
Even assuming the solder microstructure can be controlled questions remain as to whether it is also likely to be superior under realistic service conditions, whether it remains stable over time, and whether it has disadvantages for alternative damage and failure mechanisms such as solder pad cratering. This is the focus of the present report.
Pb-Free Solders, Interlaced Twinning, Land Grid Array (LGA), Ball Grid Array (BGA), Pad Cratering
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