Surface Mount International Conference Proceedings


E-3 SOLDER BUMP INTEGRITY AND JOINABILITY

Author: Addi Mistry
Company: Motorola
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Demand for semiconductors with higher pin count, improved electrical performance, reduced size, and reduced weight is making flip chip technology more prominent in many applications. Motorola has developed a new solder bump technology called the Evaporated Extended Eutectic ‘i] E-3 is an evaporated bump formed by (E-3) solder bump . modifying the Controlled Collapse Chip Connection (C4) process. Die with E-3 bumps, unlike C4, can be assembled on organic substrates with no eutectic solder deposited on the bond pads. Preliminary investigation shows better electrical contact yield is achieved on E-3 with 2 mil high bumps on the organic substrate as opposed to E-3 with 3.5 and 4.8 mil high bumps. Furthermore, by the nature of the solder joint E-3 bumps performed better than the C4 bumps in the liquid to liquid thermal cycles.



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