On The Fatigue Life Of Microelectronic Interconnects In Cycling With Varying AmplitudesAuthors: Y. Jaradat, J. E. Owens, A. Qasaimeh, B. Arfaei, L. Yin, M. Anselm, and P. Borgesen
Company: Binghamton University and Universal Instruments Corporation
Date Published: 10/14/2012 Conference: SMTA International
We and others have reported on the breakdown of common damage accumulation rules in cycling of SnAgCu solder joints. A general trend is emerging for isothermal cycling where the remaining life, after a step-down in amplitude, is consistently shorter than predicted by Miner’s rule, while a step-up tends to have the opposite effect. The effect of the latter is often minor and temporary. Each set of cycles with a given amplitude does, however, lead to a permanent increase in the rate of damage accumulation in subsequent cycling with a lower amplitude. Reductions in overall life therefore continue to increase with repeated alternations in amplitude. We show this to be consistent with the measured evolution in the associated solder properties. Similar trends were found for annealed Cu, possibly offering clues as to the underlying mechanisms.
We propose a first practical approach to the assessment of life of SnAgCu solder joints under any combination of amplitudes.
Reliability, damage accumulation rules, service conditions, life in service, Pb-free
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